Hsinchu: The next-generation AMD EPYC processor, coded “Venice,” will be the first high-performance computing (HPC) processor on the market to use Taiwan Semiconductor Manufacturing Co.’s (TSMC) advanced 2 nanometer process, Advanced Micro Devices, Inc. (AMD) announced.
According to Focus Taiwan, AMD stated that the new processor had completed the “tape-out process,” which is the final phase of the design process for integrated circuits before they enter production. The company confirmed that Venice is set to launch next year, as AMD and TSMC have co-optimized new design architectures with advanced process technology through their partnership.
AMD CEO Lisa Su recently visited TSMC Chairman and CEO C.C. Wei at the chipmaker’s headquarters in Hsinchu, where TSMC’s 2nm process is scheduled to begin production in the second half of the year. AMD emphasized that the new HPC processor represents a significant step in the execution of its data center CPU roadmap.
In its statement, AMD also highlighted the successful validation of its 5th Gen AMD EPYC central processing unit (CPU) products at TSMC’s new wafer fab in Arizona, demonstrating its commitment to U.S. manufacturing. Su noted that TSMC has been a crucial partner for many years, enabling AMD to consistently deliver leadership products that advance high-performance computing.
“Being a lead HPC customer for TSMC’s N2 process and for TSMC Arizona Fab 21 are examples of our collaboration to drive innovation and deliver advanced technologies for the future of computing,” Su said.
Fab 21, TSMC’s first facility in Arizona, began mass production in 2024 using the 4nm process. In response, TSMC’s Wei expressed pride in having AMD as a lead HPC customer for both the chipmaker’s advanced 2nm process technology and its Arizona fab.
Wei remarked, “By working together, we are driving technology scaling that results in better performance, power efficiency, and yields for high-performance silicon.” TSMC is constructing a second fab in Arizona, with commercial production expected in 2028 utilizing the 2nm and 3nm processes. The company is also planning to break ground on a third fab in the state with even more advanced processes.