Taipei: Taiwan-based IC packaging and testing services provider Powertech Technology Inc. plans to set up a joint venture in Singapore with American fabless semiconductor firm Broadcom Inc. for advanced panel level IC assembly technology development.
According to Focus Taiwan, the Taiwanese semiconductor giant announced in a statement on the Taiwan Stock Exchange that its board meeting approved a project to invest US$400 million and partner with Broadcom for the establishment of the joint venture. The collaboration aims to develop additive finger-geometry redistribution layer technology, which is expected to transform integrated circuit packaging.
Powertech stated that the joint venture aligns with its global expansion roadmap, meeting international client demand and enhancing collaboration within the global semiconductor supply chain. The company assured that existing and future cooperation on fan-out panel level packaging (FOPLP) with clients will remain unaffected.
Despite the Singapore investment, Powertech emphasized its commitment to investing in advanced IC assembly technologies and expanding production in Taiwan, maintaining a focus on core technologies and critical intellectual properties within the country. The joint venture project awaits approval from the Department of Investment Review under the Ministry of Economic Affairs and other related government agencies.
Upon securing regulatory approval, Powertech plans to disclose the project's transaction progress based on the details of the plan and legal requirements.