Taipei: Taiwan and Lithuania have entered into a collaborative agreement to enhance semiconductor technologies, focusing on the development of advanced packaging machinery for next-generation computer chips. The two nations signed a memorandum of understanding (MOU) on Friday, marking a significant step in their partnership aimed at strengthening the semiconductor industry.
According to Focus Taiwan, the MOU was signed during a ceremony in Taipei, where Industrial Technology Research Institute (ITRI) President Chang Pei-zen emphasized the initiative's objective to encourage private businesses to collaborate on developing sophisticated chip packaging equipment. This collaboration aims to leverage Lithuania's expertise in laser technology and Taiwan's capabilities in digital imaging, precision scanning, and artificial intelligence.
As part of the agreement, both governments will invest a total of 5.6 million euros (approximately US$6.5 million) over the next two years. This funding will support private sector partnerships through various international seminars, academic and industry exchanges, and technology matchmaking events, as detailed by the ITRI.
The MOU was signed by Chang Pei-zen on the closing day of the SEMICON Taiwan 2026 expo, alongside representatives from the Taiwan Electronic Equipment Industry Association and the Taiwan Electrical and Electronic Manufacturers' Association. Lithuanian representation included members from the Lithuanian Laser Association and the Center for Physical Sciences and Technology.
This agreement is a continuation of the deepening ties between Taiwan and Lithuania, which began in 2021. Since then, the two countries have entered into multiple agreements covering fields such as semiconductors, biotechnology, space technology, and advanced manufacturing.